Recently, a new picture of the Realme X7 Max packaging box has been circulating on the Internet, and many netizens have inferred that the Realme X7 Pro will be equipped with the MediaTek Dimensity 1200 chip. At present, mobile phones equipped with Dimensity 1200 chip include realme GT Neo and Redmi K40 game version.
The realme GT Neo equipped with Dimensity 1200 was released on March 31. Subsequently, the CEO of Realme India said in an interview that a new Realme machine equipped with Dimensity 1200 will be released on May 4. However, according to India is now facing a new round of epidemic challenges, the press conference may be postponed.
It is understood that the Dimensity 1200 is based on TSMC’s 6nm process, and the CPU adopts a 1+3+4 flagship triple-plex architecture design. Performance and energy efficiency are increased by 22% and 25%, respectively. It supports global 5G operators Sub-6GHz full-band, 5G Dual-card 5G standby under dual-carrier aggregation, 5G SA/NSA dual-module network.
Previously, the digital blogger @数码闲聊站 has published a comparison chart of the running scores of the Dimensity 1200 and a certain 870 model on the media platform. According to his test, the 3.0GHz A78 super core of the Dimensity 1200 has powerful performance and running points. The 710,000 is basically the same as the Snapdragon 870 model, which is much better than the previous generation Dimensity 1000+.
Starting in 2019, MediaTek has successively released Dimensity 800, 820, and 1000 series of 5G chips. According to the latest news, chips using TSMC's 4nm process technology will be released soon and will be used in the latest flagship products.
IC FLASH CONFIG 8M 20PLCC
IC NVSRAM 256 SPI 1MHZ 8SOIC
IC EEPROM 16K I2C 400KHZ 8MSOP
IC EEPROM 8K I2C 400KHZ 8MSOP
IC EEPROM 32K I2C 1MHZ 8TSSOP
IC CONFIG DEVICE 128MBIT 16SOIC
CABLE DVI TMDS 25' MALE TO MALE
Voltage Regulators - Switching Regulators 26V Fixed 5V-8A Sync Buck Converter