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SEMI predicts 29 new fabs will be built before the end of 2022.

  • Publicados:2021-06-24 09:54:42
  • Vem de onde:CMS
  • Contagem de cliques:359

On June 23, according to foreign media reports, the latest report of the International Semiconductor Industry Association (SEMI) showed that in response to the growing demand for chips in the communications, computing, healthcare, online services, and automotive markets, global semiconductor manufacturers are expected to 29 high-capacity fabs will be built before the end of 2022.

SEMI Global Marketing Director and President of Taiwan, Cao Shilun pointed out: "As the industry continues to increase its efforts to solve the global chip shortage problem, the equipment expenditure of these 29 fabs is expected to exceed 140 billion U.S. dollars in the next few years. In the medium and long term, The expansion of fab capacity will also help meet the strong demand for semiconductors from emerging applications such as self-driving cars, AI artificial intelligence, high-performance computing, and 5G to 6G communications."

China and Taiwan each have 8 new wafer fab construction projects ahead of other regions, followed by the Americas with 6, Europe/Middle East 3, and Japan and South Korea each with two (Figure 1). Among the new construction projects, 12-inch (300mm) wafer fabs are the bulk, 15 in 2021 and 7 to be built in 2022. The other 7 fabs to be built within two years are 4-inch (100mm), 6-inch (150mm) and 8-inch (200mm) fabs. A total of 29 fabs can produce up to 2.6 million wafers (8 inches) per month.

Of the 29 fabs that are expected to start construction in 2021 and 2022, 15 are foundries, with a monthly capacity of 30,000 to 220,000 wafers (8 inches); the memory department will start construction of fabs within two years There are 4, these new factories have higher production capacity and can produce 100,000 to 400,000 wafers (8 inches) per month.

Furthermore, it usually takes at least two years to reach the equipment installation stage after the construction of a new plant. Therefore, most semiconductor manufacturers starting to build a new plant this year will not be able to start the installation until 2023 at the earliest. However, some manufacturers may advance in the first half of next year. Related work will start.

Although the report predicts that there will be 10 high-capacity fabs that will start next year, it does not rule out the possibility that chip manufacturers will announce new construction projects during the period and the numbers will rise. The "Global Fab Forecast Report" tracks fab construction and equipment investment, as well as capacity, products and technology from 2021 to 2022.

In addition to the 29 fabs that are expected to be built in 2021 and 2022, the report also summarizes information on 8 other low-probability construction projects that may start construction in the same period.


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